20W Ceramic Case

20W ceramic case is a specialized packaging solution designed for medium-power circuits, power amplifier modules, and 5G small cell components-applications where high-frequency signal integrity, efficient heat dissipation, and electromagnetic shielding are non-negotiable. It's constructed from high-purity alumina ceramic (96% Al₂O₃ content), a material selected for its stable dielectric properties: with a dielectric constant of 9.8 (±0.2) at 1MHz and an ultra-low loss factor (<0.0002 @1MHz), it minimizes signal attenuation in RF systems-critical for 5G networks that rely on high-frequency bands (24–40 GHz) where signal loss is a major challenge.

The manufacturing process of the 20W ceramic case is optimized for high-frequency performance. After powder molding and sintering at 1680℃, the inner and outer surfaces undergo precision polishing to achieve a roughness (Ra) of <0.1 μm-this reduces signal reflection caused by surface irregularities. For electromagnetic shielding, a thin layer of copper (5–10 μm) is plated on the inner walls via electroless deposition, then nickel-plated (2 μm) for corrosion resistance, delivering a shielding effectiveness of 40 dB at 2.4 GHz (the frequency used in most IoT and 5G small cell systems). This means unwanted external signals are blocked, and internal RF energy doesn't leak-preventing interference with nearby devices.