Component Pre-processing: Rigorous incoming material inspection is essential, including visual inspection and electrical performance testing, to ensure components meet specifications. For ESD-sensitive components, operation in an anti-static environment is required to prevent ESD damage.
Soldering Process Control: Reflow and wave soldering temperature profiles must be precisely matched to the component's temperature resistance rating. For example, lead-free soldering must be controlled below 260℃ to avoid thermal damage. Post-soldering, AOI (Automated Optical Inspection) or X-ray inspection is necessary to identify defects such as cold solder joints and bridging.
Functional Debugging and Aging Testing: Post-assembly, power-on testing and load aging are required to simulate real-world operating environments (such as high temperature and humidity) to ensure product stability. For example, power devices must operate continuously at full load for at least 72 hours to verify reliability.
Supply Chain Collaboration: Collaboration with certified suppliers is crucial for critical materials (such as wafers and special ceramic substrates). Batch traceability records must be maintained to address unforeseen quality issues.
Our company's main products, such as ROHM MOSFETs and IGBT modules, all undergo the above-mentioned full-process control. Before leaving the factory, 100% of electrical parameters are tested and environmental sampling tests are conducted to ensure that delivered products meet industrial-grade standards.
